• Aluminum-Based PCB LED Board
  • Aluminum-Based PCB LED Board
  • Aluminum-Based PCB LED Board
  • Aluminum-Based PCB LED Board
  • Aluminum-Based PCB LED Board
  • Aluminum-Based PCB LED Board
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Aluminum-Based PCB LED Board

Type: Rigid Circuit Board
Flame Retardant Properties: V0
Dielectric: FR-4
Base Material: Aluminum
Insulation Materials: Epoxy Resin
Processing Technology: Electrolytic Foil

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Miembro Diamante Desde 2023

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Información Básica.

No. de Modelo.
1PXMDO10689
Application
Consumer Electronics
Mechanical Rigid
Rigid
Material
Fiberglass Epoxy
Brand
Shengyi, Kb, Nanya, Ilm
criterios
aql ii 0,65
tamaños de taladro
0,15mm/0,2mm
borde biselado
impedancia
50/90/100 Ohm
Trace Width(Min.)
6mil.
tratamiento de surfec
osp
Paquete de Transporte
Vacuum Packaging
Especificación
80*80mm
Marca Comercial
XMANDA
Origen
Made in China
Código del HS
8534001000
Capacidad de Producción
50000sqm/Month

Descripción de Producto

Aluminum-Based PCB LED BoardAluminum-Based PCB LED BoardAluminum-Based PCB LED BoardAluminum-Based PCB LED BoardAluminum-Based PCB LED BoardAluminum-Based PCB LED Board

Specifications:

Layers: 1
Thickness:1.6mm
Material: FR4 KB6165
Size: 80*80mm
Surface treatment:osp
Line width/spacing: 6/6mil
Minimum aperture: 0.25mm
Solder mask color: White
Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ
Aluminum-Based PCB LED Board

 

Aluminum-Based PCB LED BoardAluminum-Based PCB LED BoardAluminum-Based PCB LED BoardAluminum-Based PCB LED Board
 

Aluminum-Based PCB LED Board
Aluminum-Based PCB LED Board
Aluminum-Based PCB LED Board
Aluminum-Based PCB LED Board
 
Aluminum-Based PCB LED Board
Aluminum-Based PCB LED Board
Aluminum-Based PCB LED Board

Features:

1. The integration of the board design is very high, the thickness-to-diameter ratio exceeds 10:1, and the difficulty of electroplating of copper is high.
2. Made of TG170 material


Shenzhen XMD Circuits Co.,Ltd, previously known as Jaleny(jlypcb), was founded in 2009 and started the journey of circuit board in Shenzhen,China. Through the introduction of advanced production and testing equipment and technical exchanges with factories in the same industry and engineering colleges, XMD greatly expanded the process capacity of double-sided board and multi-layer board. In 2011, we began to explore overseas markets and export foreign orders to all parts of the world. In 2018, Jiangxi Ji'an added a new production line, mainly making batch orders.

Able to produce 50,000 sqm of PCBs monthly
One-stop solutions for clients (PCB & PCBA)
Over 12 years of Experience in PCBs
Avg Response time: ≤24 h (experienced Engineers to Serve you)
Comply with RoHS,TS16949,ISO9001 and UL certifications.
Flexibilities in Shipment Arrangement (FOB HK or Shenzhen by sea or by air, CIF via DHL,Fedex,UPS or TNT etc.)

 

A professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs.

High-quality Raw Material

★Traceable source of branded raw material
★Standardized procurement process
★Strict supplier selection policy

Production Equipment
★High precision processing equipment
★Efficient operation guarantees quality
★Meet various special technical processes

Intelligent System
★Intelligent audition
★Intelligent CAM
★Intelligent paneling
★Intelligent production

Strict Inspection
★100% AOI testing
★100% FQA/FQC
★Quality Control
★'Failed One Lost Ten'

 
Our Capabilities and Technology
Items 2022 2023
Layers (MP):22layer,(Sampling):32 layer (MP):32layer
Max. Board THK Sampling 4.0mm / MP :3.2mm Sampling 5.0mm / MP:3.2mm
Min. Board THK Sampling :0.4mm /MP :0.5mm Sampling: 0.3mm / MP:0.4mm
Base copper Inner layer 1/3 ~ 6OZ 1/3~8 OZ
Outer layer 1/3 ~ 6 OZ 1/3 ~ 8 OZ
Borehole diameter Min.PTH 0.2mm 0.15mm
Max. aspect ratio 10:01 12:01
HDI aspect ratio 0.8:1 1:01
Tolerances   PTH ±0.076mm ±0.05mm
  NPTH ±0.05mm ±0.03mm
Solder mask opening 0.05mm 0.03mm
Solder dam (Green) 0.076mm , (Green) 0.076mm ,
(other color) 0.1mm (other color) 0.08mm
Min. core THK. 0.1mm 0.08mm
Bow&twist ≤0.5% ≤0.5%
Routing Tol.  Sampling :±0.075mm /MP:±0.1mm Sampling:±0.075mm /MP:±0.075mm
Impedance Tol. ±10% ±8%
Min. w/s (Inner layer) 0.075 / 0.075mm 0.075 / 0.075mm
Min. w/s (Outer layer) 0.075 / 0.075mm 0.075 / 0.075mm
 (Min. BGA size) 0.2mm 0.15mm
(pitch)(Min. BGA Pitch) 0.65mm 0.5mm
(Working panel size) 600mm*700mm 600mm*700mm
Special process Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. 



 

 

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