Tipo: | Placa de Circuito Rígido |
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Dieléctrico: | FR-4 |
Material: | Epoxi Fibra de Vidrio |
Aplicación: | Comunicación |
Propiedades retardantes de llama: | V0 |
Mecánica rígida: | Rígido |
Proveedores con licencias comerciales verificadas
.1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs |
.Blind/buried vias with sequential lamination |
.HDI build up micro via technology with solid copper filled vias |
.Via in pad technology with conductive and non-conductive filled vias |
.Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. |
.Special materials and hybrid construction |
FACTORY AND EQUIPMENT
Proveedores con licencias comerciales verificadas