Electronics Circuit Board PCBA PCB Circuit Boards Custom PCBA for Electronics Circuit Board

Electronics Circuit Board PCBA PCB Circuit Boards Custom PCBA for Electronics Circuit Board

US$ 0,10 - 5,00 1 Pieza (MOQ)
Puerto:
Guangzhou, China
Paquete de Transporte:
envasado al vacío
Condiciones de Pago:
L/C, T/T, Paypal, west

Última Fecha de Inicio de Sesión:

Feb 18, 2025

Tipo de Negocio:

Fabricante/Fábrica

Productos Principales:

La fabricación de PCB, PCB Asamblea, IC sustrato, Diseño de PCB

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Descripción de Producto

Información de la Compañía

Información Básica

No. de Modelo.
PCBA
Type
Rigid Circuit Board
Dielectric
Fr-4
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Especificación
2L-32L

Descripción de Producto

CIRCUITS (Design for manufacturing capability)-Rigid
ItemNamelimit capability(sample)limit capability(small-medium volume)
1MaterialNormal FR-4Brand: KingBoard, ShengYi, ITEQBrand: KingBoard, ShengYi, ITEQ
2Special materialNormal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, CeramicNormal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, Ceramic
3TypeRigid PCBMulti-blind&Buried, thick copper, Via in Pad(copper filled, resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated.Multi-blind&Buried, thick copper, Via in Pad(resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated.
4Lay upBlind&Buriedlamination3timeslamination2times
5Surface
Finish
Lead-freeLead-free with HASL,Electroplated gold(Substrate thickness2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIGLead-free with HASL,Electroplated gold(Substrate thickness1OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIG
6LeadedLead with HASLLead with HASL
7Plating/coating
thickness
HASL2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)
8Electroplated goldNi:3-5UM;Au;0.025-0.1UMNi:3-5UM;Au;0.025-0.1UM
9ENIGNi:3-5UM;Au;0.025-0.1UMNi:3-5UM;Au;0.025-0.1UM
10Immersion Tin1.0UM1.0UM
11Immersion Sliver0.1-0.3UM0.1-0.3UM
12OSP0.2-0.3UM0.2-0.3UM
13Hard Gold1.25UM1.25UM
14ENEPIGNi:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UMNi:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UM
15Carbon Ink0.1-0.35UM0.1-0.35UM
16Soldermask15-25UM(on copper area),8-12UM(on via pad and on circuits around the corner)(just for one-time print and copper thickness<48um)15-25UM(on copper area),8-12UM(on via pad and on circuits around the corner)(just for one-time print and copper thickness<48um)
17Peelable Soldermask0.2-0.5MM0.2-0.5MM
18HoleFinshed mechanical hole size0.10-6.2mm(corresponding drilling tool size is 0.15-6.3mm)0.15-6.2mm(corresponding drilling tool size is 0.2-6.3mm)
19Min finished hole size for PTFE material and hybrid PCB is0.35mm(Corresponding drilling tool size is 0.45mm)Min finished hole size for PTFE material and hybrid PCB is0.35mm(Corresponding drilling tool size is 0.45mm)
20Max finished hole size for blind & buried via is not greater than 0.2mm(corresponding drilling tool size is not greater than 0.3mm)Max finished hole size for blind & buried via is not greater than 0.2mm(corresponding drilling tool size is not greater than 0.3mm)
21Min slot hole size is 0.5mm(corresponding drilling tool size is 0.6mm)Min slot hole size is 0.5mm(corresponding drilling tool size is 0.6mm)
22Min finished hole size for via pluged with solder mask is 0.3mm(corresponding drilling tool size is 0.4mm)Min finished hole size for via pluged with solder mask is 0.3mm(corresponding drilling tool size is 0.4mm)
23The scope of finished hole size for via-in-pad filled with resin is 0.1-0.4mmThe scope of finished hole size for via-in-pad filled with resin is 0.1-0.4mm
24Max finished hole size for vias plated shut with copper is 0.15mm(corresponding drilling tool size is 0.25mm)/
 1/3 of half-hole(pth)Min gap between hole wall and profile is 0.17mmMin gap between hole wall and profile is 0.2mm
 half-hole(pth)Min half-hole(pth) size is 0.5mmMin half-hole(pth) size is 0.6mm
25Laser drilling sizeThe scope of laser drilling size is 0.1-0.15mmThe scope of laser drilling size is 0.1-0.15mm
26Aspect Ratio0.15mm(The board thickness is not greater than 1.0mm)/
27MAX aspect ratio for Hole plate is 10:1(The smallest drilling tool size is 0.2mm)MAX aspect ratio for Hole plate is 8:1(Min drilling tool size is greater than 0.2mm)                              (If the min drilling tool size is 0.2mm, then the aspect ratio for Hole plate is 8:1)
28Hole location tolerance±3mil±3mil
29PTH tolerance±3mil±3mil
30Pressfit holes tolerance±2mil±2mil
31NPTH tolerance±2mil±2mil
32The aspect ratio for hole filled with resinMAX aspect ratio for Hole plate is 10:1.(The smallest drilling tool size is 0.2mm)MAX aspect ratio for Hole plate is 8:1.(The smallest drilling tool size is 0.2mm)
33Countersink angle tolerance±10°±10°
34Countersink hole size tolerance±0.2mm±0.2mm
35Countersink depth tolerance±0.2mm±0.2mm
36Routing tolerance (edge to edge)±0.1mm±0.1mm
37The tolerance for depth-control groove milling±0.2mm/
38Min tolerance for routing slot±0.127mm±0.15mm
39Pad(ring)Min Pad size for via hole14mil(8mil drillings,18/35UM base copper),20mil(8mil drillings,70UM base copper),24mil(8mil drillings,105UM base copper)20mil(8mil drillings,18/35UM base coppe),24mil(8mil drillings,70UM base copper),26mil(8mil drillings,105UM base copper)
 Min Pad size for component hole20mil(8mil drillings,18/35UM base copper),24mil(8mil drillings,70UM base copper),26mil(8mil drillings,105UM base copper)22mil(8mil drillings,18/35UM base copper),26mil(8mil drillings,70UM base copper),28mil(8mil drillings,105UM base copper)
40Min BGA pad sizeENIG,Immersion Tin,Immersion Sliver,OSP:≥8milENIG,Immersion Tin,Immersion Sliver,OSP:≥10mil
41HASL:Independent track area8mil,Soldermask opening area for copper plane:≥14mil HASL:Independent track area10mil,Soldermask opening area for copper plane:≥16mil 
42Pad size tolerance.+/-1.5mil(pad size10mil);+/-10%(pad size>10mil).+/-1.5mil(pad size10mil);+/-10%(pad size>10mil)
43Width/SpaceInternal Layer(Substrate) 1/3OZ,1/2OZ        3.5/3.5mil 1/3OZ,1/2OZ        4/4mil
441OZ                  3/4mil1OZ                  3/4mil
452OZ                  5/6mil2OZ                  5/6mil
463OZ                  6/7mil3OZ                  7/9mil
474OZ                  8/11mil4OZ                  9/12mil
485OZ                  10/16mil5OZ                    /
49External Layer(Substrate)1/3OZ                3.5/3.5mil1/3OZ                4/4.5mil
501/2OZ                3.5/3.5mil1/2OZ                4/4.5mil
511OZ                  4.5/5mil1OZ                  5/5.5mil
522OZ                  6/8mil2OZ                  6.5/8mil
533OZ                  8/12mil3OZ                  8/13mil
544OZ                  9/15mil4OZ                  10/16mil
555OZ                  11/16mil5OZ                  12/18mil
56Width tolerance10mil:±1mil10mil:±1.5mil
57>10mil:±1.5mil>10mil:±2.0mil
58SpaceMin gap between hole wall and
conductor (None blind and buried via PCB)
8mil(1 time laminating),9mil(2 time laminating),10mil(3 time laminating),9mil(1 time laminating),10mil(2 time laminating)
596mil(<8L),7mil(8-12L),8mil(≥14L)7mil(<8L),8mil(8-12L),9mil(≥14L)
60Min gap between profile and
design of inner layer
8mil8mil
61Min space of the V-scored does not reveal the copper(Central Line of V-scored to internal /external circuits, Red marking:the angle of V-scored  H:the finished board thickness )H1.0mm:0.3mm(20°),0.33mm(30°),0.37mm(45°),0.42mm(60°)H1.0mm:0.3mm(20°),0.33mm(30°),0.37mm(45°),0.42(60°)
621.0<H1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°),0.6mm(60°)1.0<H1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°),0.6mm(60°)
631.6<H2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°),0.8mm(60°)1.6<H2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°),0.8mm(60°)
642.4<H3.0mm:0.47mm(20°),0.59mm(30°),0.77mm(45°),0.97mm(60°)2.4<H3.0mm:0.47mm(20°),0.59mm(30°),0.77mm(45°),0.97mm(60°)
65OthersMin width of internal clearance8mil8mil
66Min space of milling does not reveal the copper on the internal /external layer.8mil8mil
67Min space of gold finger bevelling does not reveal the copper .8mil10mil
68Min space bwteen hole walls in different net8mil10mil
69Min gap between copper pads during ENIG4mil5mil
70Min gap between gold fingers6mil7mil
71Min gap between copper pads during HASL(Without soldermask bridges)6mil(At least the spacing of 10mil between copper pads in large copper plane)7mil(At least the spacing of 10mil between copper pads in large copper plane)
72Min gap between peelable soldermask and copper pads14mil16mil
73Min gap between silkscreen and copper pads6mil8mil
74Min gap between carbon ink and copper pads10mil12mil
75Min gap between carbon inks13mil16mil
76Layer counts of metal-substrate PCB1-4L2L Need to be evaluated
77Dimension tolerance of metal-substrate PCB(Include depth tolerance of depth-control groove
milling
)
±0.15mm±0.15mm
78Partial surface treatment of metal-substrate PCB HASL,Electroplated gold(Substrate thickness2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,,ENEPIG HASL,Electroplated gold(Substrate thickness2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,,ENEPIG
79Thermal conductivity1-4W/mK1-4W/mK
 Breakdown voltage500-5000V500-5000V
80Metal material typeMetal-core,Mixed pressure of metal and FR4Metal-core,Mixed pressure of metal and FR4
81Min core of internal Layer0.13mm0.2mm
82Layer counts1-30L1-30L
83PCB thickness(Substrate)HASL:0.6-3.2mmHASL:0.6-3.2mm
84Other surface treatment :0.2-6.0mmOther surface treatment:0.2-6.0mm
85Max finished size(H means board thickness)HASL:350×300mm(0.4H<0.8mm),420×350mm(0.8mmH<1.2mm),HASL:350×300mm(0.4H<0.8mm),420×350mm(0.8mmH<1.2mm),
86(H>1.2mm):2L 550×1000mm;4L 550×900mm;6L and above 500×600mm(H>1.2mm):2L 550×1000mm;4L 550×900mm;6L and above 500×600mm
87Registration accuracy between layers 5mil6mil
88The finished board thickness tolerance (H means board thickness)H1.0mm:±0.1mmH1.0mm:±0.1mm
891.0<H1.6mm:±8%1.0<H1.6mm:±8%
90H>1.6mm:±10%H>1.6mm:±10%
91Impedance tolerance±5Ω(<50Ω),±10%(≥50Ω)±5Ω(<50Ω),±10%(≥50Ω)
92Outline dimension tolerance ±0.1mm±0.13mm
93Outline position tolerance±0.1mm±0.1mm
94Min bow&twistBlind/Buried hole board or dissymmetrical laminated construction:1.0%Blind/Buried hole board or dissymmetrical laminated construction:1.0%
 Normal:0.75%Normal:0.75%
95The thickest copper of inner layer4OZ3OZ
96The thinnest insulating layer3.5mil(HOZ base copper)4mil(HOZ base copper)
97Min width and height of silkscreen Width 5mil,height 25mil(1/3,1/2OZ base copper);           Width 6mil,height 32mil(1/1OZ base copper);                Width 7mil,height 45mil(2/2OZ base copper)Width 5mil,height 25mil(1/3,1/2OZ base copper);                       Width 6mil,height 32mil(1/1OZ base copper);                         Width 7mil,height 45mil(2/2OZ base copper)
98Min radius of the inner corner0.4mm0.4mm
99V-CUT angle tolerance±5°±5°
100V-CUT symmetrical tolerance±0.1mm±0.1mm
101The remain thickness tolerance of V-CUT±0.1mm±0.1mm
102RoutingMilling,V-CUT,Bridge connection,Stamp holes,PunchingMilling,V-CUT,Bridge connection,Stamp holes,Punching
103Min width of soldermask bridgeFinished copper1OZ:4mil(Green),5mil(Other color)Finished copper1OZ:4mil(Green),5mil(Other color)
104Finished copper2-4OZ:8milFinished copper2-4OZ:8mil
105Min width of soldermask cover track2.0mil2.5mil
106Soldermask colorGreen matte/glossy, Yellow,Black matte/glossy,Blue matte/glossy ,Red,WhiteGreen matte/glossy, Yellow,Black matte/glossy,Blue matte/glossy ,Red,White
107Silkscreen colorWhite,Yellow,Black,Gray,OrangeWhite,Yellow,Black,Gray,Orange
108Gold finger bevelling tolerance±5°±5°
109The remain thickness tolerance of the gold finger bevelling±0.13mm±0.13mm
 
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